我以为是3D DRAM，一查是low-power version of HBM

"low-power version of HBM". It focuses on utilizing vertical (Z-axis) stacking and Intel's Embedded Multi-Die Interconnect Bridge (EMIB) to achieve 2x-3x the capacity of current High Bandwidth Memory (HBM) at roughly half the power.

 

• 3D DRAM: Major manufacturers like Samsung and SK Hynix are developing it, with 3D DRAM expected to enter the market later in the decade (roughly 2027–2030).
• ZAM: Prototypes are expected by early 2028, with commercialization slated for 2029

所有跟帖： 

• 如果在今年就能投产的话，还是很有希望赚大钱的。 -桃花源里人家- ♂ (0 bytes) () 02/03/2026 postreply 20:08:08

• One generation memory product take a few years -RomaVacation- ♂ (162 bytes) () 02/03/2026 postreply 20:43:52

• 半导体就是这样。工艺步骤太多太复杂，工艺参数无穷多，而且没有多少可靠公式，都是数据累积 -桃花源里人家- ♂ (0 bytes) () 02/03/2026 postreply 21:34:25