芯片最后的测试封装环节70%来自中国和马来西亚，要改变不容易

来源: wjhwsh 于 2025-04-17 05:49:30 [博客] [旧帖] [给我悄悄话] 本文已被阅读：次

WENXUECITY.COM does not represent or guarantee the truthfulness, accuracy, or reliability of any of communications posted by other users.