芯片拆解机构TechInsights分析华为麒麟9030移动芯片，已经采用SMIC N+3工艺。性能大致相当于5纳米。

来源: thore 于 2025-12-15 03:06:59 [旧帖] [给我悄悄话] 本文已被阅读：次

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