春风吹又生:矽谷华人探讨半导体业回升寻找未来突破

在欧美大陆刚刚经历了2008-2009年的经济危机后，在举世瞩目的高科技圣地美国矽谷，华人工程师们对高科技的核心半导体行业的未来及复兴开始了新一轮的探索。华美半导体协会（Chinese American Semiconductor Professional Association）将为此专门举办春季半导体行业研讨会。此次大会主题是半导体行业回升及对未来集成电路制造，设计及应用新技术的探索及前景的展望。届时将有来自矽谷半导体行业巨头 Intel, Cadence, EMC的执行长，副总裁，以及加州大学伯克利分校主任教授兼美国国家实验室主任出席并进行主题演讲。演讲内容包括摩尔定律的未来；集成电路制造工艺面临的新挑战；纳米光刻技术新突破； 多核构架和系统集成芯片的开创性设计及验正方法；以及如何打造以多核芯片构架为核心的超速数据处理系统云计算平台。此次大会将在三月六日下午在Intel 矽谷圣塔克拉拉总部举行。大会具体详情，请到华美半导体协会网址查询http://www.caspa.com/events/symposium

With global economy still being deeply in recession, the high tech industry in Silicon Valley has already been positioned for a strong recovery. At the heart of today’s information technology, semiconductor technology is undergoing a new round of innovations driven by future demands from hardware to software applications. The Moore’s Law continues to advance, but with increasing challenges, where process and design are required to be co-optimized to achieve the best scaling benefit. Recent technology breakthrough in nano-scale lithography has unveiled future direction for semiconductor fabrication. Targeting to achieve higher performance with more efficient computing, the computing paradigm is experiencing a big reform from traditional frequency driven pipelining techniques to either multi-core homogenous computing with massive parallelism, or highly integrated system-on-chip solutions with heterogeneous computing. Multi-core architectures are both platforms and targets for future IC design, as well as the kernels for future throughput computing for data center applications.